Beschreibung
- ROL0 flux classification
- Wide process window
- Excellent wetting compatibility on most board finishes
- Clear residue
- High temperature compatible
Application:
NC-559-ASM-TF is formulated for syringe, stencil printing, and rework applications on all PCB surface finishes. It may be used for BGA sphere attachment and reballing. Additionally, NC-559-ASM-TF is designed to work on all flip chip bumping and chip scale packaging sites.
